Small silicon wafers {chip} {integrated circuit}| can have etched circuits of semiconductor transistors, resisters, capacitors, and diodes. Number of transistors doubles every one and a half to two years {Moore's Law}.
Integrated circuits {application-specific integrated circuit}| (ASIC) can have fixed logic blocks programmed in one configuration.
Light processing {digital light processing}| (DLP) can use a chip with thousands of micromirrors, to deflect colored light from a spinning color wheel.
Integrated circuits {field-programmable gate array}| (FPGA) can have programmable logic blocks.
Machines {microelectromechanical system} (MEMS) can have small mechanical and electronic parts. Silicon cells can move surfaces electrically.
Transistors {nanofluidic transistor}| can control ion flow in microscopic silica tubes.
Boards {printed circuit}| can have copper conducting pathways on one side and holes into which to solder circuit elements to conductor on other side. Film emulsion can cover board, negative of desired pattern goes on, camera photographs board, and negative develops. Silver is on conductor pathways. Electroplating puts copper on board.
Board can have a copper layer and a film emulsion that resists acid. Negative goes on, camera photographs board, and negative develops. Acid etches copper away. Then emulsion washes away, leaving copper pathways.
Memory and logic can be on same chip {processor-in-memory}|.
Chips {thin-film integrated circuit}| can have small lasers, prisms, lenses, and switches to move light instead of electrons. More information can travel in light than in electrons, because light frequency is 10,000 greater than electron current frequency.
7-Machine-Kinds-Electronic-Parts
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Date Modified: 2022.0225